Intel’s 3D Transistors Chip Will Be Bundled In Ivy Bridge processors In
Intel had unveiled its new chip technology 3D transistors chip that is supposed to be more powerful than the current chip and will allow computers, smartphones and tablets to become more faster and more power-efficient.
Power efficiency will increase by 37 % as compared to traditional two dimensional “planar” gate.Upcoming “Ivy Bridge” processors will be boasting this technology and it might be available by the end of 2012.In April Intel had stated that they will be releasing its first true ARM competitor in 2013. Company will be using this 3D transistor structure on all chips produced on its 22nm manufacturing process.
